Work experience, Micro Electronics
Custom Interconnect · Andover · on site
During my Micro Electronics placement at Custom Interconnect Ltd, I worked on assembly-jig design and learned about semiconductor manufacturing processes.
- I designed assembly jigs in SolidWorks and co-developed a 3D-printed prototype. I tested it against production equipment in the cleanroom; we refined the design before release for CNC manufacture.
- I trained in SolidWorks by reverse-engineering a physical component using vernier calipers to produce an accurate 3D model.
- I followed chip-on-board packaging end to end: wafer dicing against customer known-good-die data, die attach to in-house PCBs, wire bonding and glob-top encapsulation.
- I took part in wire-bonding operations and trained on the wire-bonding machine.
- I worked to cleanroom discipline: full gowning, ESD control and airborne particle monitoring to maintain ISO 14644-1 classification.
- I applied Python from GCSE Computer Science to test and debug an existing Tower of Hanoi implementation, working through move validation and state-handling logic.
Jul 2024
